1. Strong compatibility: compatible with all types of PCB/OLED/flexible circuit films, equipment reuse rate increased by 70%, initial cost directly reduced by 50%+.
2. Zero consumables: non-contact laser cutting, zero die loss, annual consumables savings of more than 800,000+.
3. Agile response: pattern library switching in seconds, order conversion time <2 minutes, no worries about fragmented production.
4. Equipped with dust collection module: fully enclosed negative pressure dust removal.
5. Ultra-long standby: 7×24 hours continuous cutting without attenuation, laser life ≥80,000 hours, operation and maintenance costs reduced by 60%.

Film cutting machine
The film cutting machine is specially designed for high-precision electronic material processing, using laser technology, supporting micron-level cutting of film substrates such as PCB, OLED, and flexible circuits (precision ≤10μm), suitable for 0.01-2mm thickness, narrow melting edge, and low thermal damage. Integrated visual positioning and process library, complex graphics can be switched with one click, cutting speed ≥200mm/s, yield ≥99.5%. Fully enclosed negative pressure dust removal system ensures cleanliness, compatible with automatic loading and unloading of coils/sheets, daily average production capacity increased by 3 times, helping consumer electronics, display panels and other industries to achieve high-quality, high-efficiency and low-carbon production.

Highlights
1. Processing according to the drawing, one-time molding
2. Fast cutting speed, no black edges, no burrs
3. Use visual alignment to achieve high-precision cutting
4. No tool consumables, low operating costs
5. 7×24 hours continuous cutting without attenuation

Features
1. Use CO2 laser to focus μm-level spot to cut flexible film layer;
2. High-precision linear motor working platform, high precision and fast speed;
3. CCD automatic positioning and automatic correction can be selected; honeycomb board adsorbs fixed board, no need for alternative fixtures;
4. The processing process is automatically controlled by computer software, and the software interface provides real-time feedback to understand the processing status in real time;
5. Compatible with special-shaped pattern cutting;

Applications
1. Flexible perovskite component manufacturers
2. SPD and PDLC dimming film manufacturers
3. High-end flexible material processing in consumer electronics, semiconductors, medical devices, automotive electronics and other industries
4. For other battery materials, please consult our relevant personnel

Specifications
1. Product size: 1600mm*1300mm and below
2. Industrial camera equipped with high-power telecentric lens, CCD positioning accuracy ≤±3μm
3. Processing object: Laser full cutting and half cutting of film materials
4. Processing type: straight line or special shape
5. Maximum cutting speed 500mm/s (depending on the material)
6. Maximum moving speed 500mm/s
7. Cutting platform: vacuum adsorption platform (made of aluminum or honeycomb board)
8. Melt edge: ≤150um
9. File formats that can be processed: standard Gerber files, DXF files, DWG files, etc.
10. Windows 11 control PC, 21.5-inch monitor
11. TeamViewer remote access
12. Installation and training on site by Microtreat staff
13. Dust is collected by dust collector, exhaust flow: >200m3/h, duct diameter: ￠100mm
14. Compressed air Pressure: 0.5～0.7Mpa, flow rate: <200L/min, compressed air pipe diameter: ￠10mm
15. Marble base and metal welded frame
16. Ground feet with seismic isolation function
17. Dimensions: 2400mm×2200mm×2600mm (subject to the actual product), 3000kg
18. Rated power 12KW
19. 3-color status signal tower

Options
1. Local power
>208V/60Hz
>480V/60Hz
2. Power selection
>CO2 output power: 60W~300W
3. Contact us to learn about your specific needs