1. Strong compatibility: can cut/drill/mark, reduce procurement costs, save plant space;
2. Zero consumables: non-contact laser process, zero tool loss;
3. Second-level line change: hundreds of sets of processes are stored in advance, and the order switching time is less than 1 minute;
4. Invisible loss reduction: heat-affected zone ≤10μm, providing material utilization improvement;

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FPC circuit board laser processing equipment
FPC board laser processing equipment is specially designed for high-precision processing of flexible circuit boards. It integrates three-in-one functions of laser cutting, drilling and marking. It adopts non-contact ultrafast laser technology to achieve micron-level processing accuracy (line width ≤15μm), heat-affected zone ≤10μm, and eliminates material deformation and carbonization. Equipped with intelligent process library and visual positioning, it supports the switching of complex graphics from micro-holes to multi-layer blind grooves in seconds, and adapts to the efficient production of fragmented orders.

Highlights
1. No need to open molds, process according to drawings, and form in one go
2. Cut without black edges or burrs
3. Use visual alignment to achieve high-precision cutting
4. No tool consumables, low operating costs

Features
1. Adopt high-performance lasers and cold light sources, laser cutting heat-affected zone as small as 10μm, high-precision scanning galvanometer, high precision and long life;
2. High-precision linear motor working platform, high precision and fast speed;
3. CCD automatic positioning and automatic correction can be selected; vacuum adsorption fixed plate, no need for alternative fixtures;
4. The processing process is automatically controlled by computer software, and the software interface provides real-time feedback to understand the processing status in real time;
5. The minimum focus spot can reach 10μm, which is suitable for fine cutting and drilling of any organic/inorganic materials.

Applications
1. FPC flexible circuit board cutting
2. FPC soft and hard combination board cutting
3. OLED plane cutting
4. PI/PET polymer material cutting
5. Suitable for R&D and small batch production, equipped with automatic loading and unloading mechanism to achieve large-scale mass production needs
6. For other battery materials, please consult our relevant personnel

Specifications
1. Processing range: 500*400mm (customizable according to needs)
2. Marble motion platform positioning accuracy ≤±2μm, repeatability ≤±1μm
3. CCD positioning accuracy ≤±3μm
4. Galvanometer repeatability ≤±1μm
5. Cutting size accuracy ≤±20μm
6. Cutting position accuracy ≤±30μm
7. Processing edge burr size ≤20μm (determined by material)
8. Processable file formats: standard Gerber files, DXF files, DWG files, etc.
9. Windows 11 control PC, 21.5-inch monitor
10. TeamViewer remote access
11. Installation and training by Microtreat staff on site
12. Dust is collected by dust collector, exhaust flow: >200m3/h, air duct diameter: ￠100mm
13. Compressed air pressure: 0.5~0.7Mpa, flow: <200L/min, compressed air pipe diameter: ￠10mm
14. Marble base and metal welded frame
15. Ground feet with seismic isolation function
16. Overall dimensions: 1550mm×1450mm×2000mm, 2300kg (500x400mm processing platform)
17. Rated power 15KW
18. 3-color status signal tower
19. Interlock or Sensor installed at all door panel positions

Options
1. Local power
>208V/60Hz
>480V/60Hz
2. Multiple laser wavelengths for optimal material absorption
>355nm 15W output power
>1064nm 30W output power
3. Lasers with different pulse widths: nanosecond fiber lasers, picosecond, femtosecond and other ultrafast lasers
4. Contact us to learn about your specific needs