1. Cutting: supports high-precision laser cutting of various special-shaped glass, realizing non-contact, high-precision processing;
2. Punching: supports high-precision, ultra-small aperture (less than 100μm), ensuring optical transmittance and mechanical strength;
3. Engraving: with high precision, high definition, and non-contact;

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Suitable for straight or special-shaped cutting, drilling, and engraving of ordinary glass or chemically strengthened glass
Glass laser processing equipment is specially designed for high-precision glass processing, which can integrate cutting, punching, and engraving functions. It adopts ultra-fast cold laser technology to achieve crack-free and edge-free processing (cutting accuracy ±5μm, aperture range 0.1-5mm adjustable), and is suitable for 0.1-20mm thick glass. The fully automatic visual positioning system supports complex graphic engraving and special-shaped cutting, with edge roughness Ra≤0.5μm, processing speed of 800mm/s, and yield ≥99%. The non-consumable design combined with energy control is compatible with photovoltaic glass, electronic cover plates, building curtain walls and other scenarios, meeting the needs of personalized engraving of consumer electronics and industrial-grade efficient mass production, helping customers reduce costs, increase efficiency and upgrade processes.

Highlights
1. Non-contact processing, less damage to materials, no consumables, low operating costs
2. Linear motor motion platform, equipped with high-definition CCD visual positioning, fast speed and high precision
3. According to different material thicknesses, different focal depth cutting heads can be freely selected,
4. CAD drawings are directly imported, and the product replacement efficiency is fast, suitable for various special-shaped cutting

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Features
1. The equipment adopts a marble platform X/Y system and adopts a linear motor drive system to ensure the accuracy and stability of the platform's high-speed operation.
2. Configure high-pixel CCD automatic alignment function to ensure product cutting alignment accuracy.
3. High-power picosecond laser, PSO signal control mode, to ensure uniform laser point spacing when the platform moves and decelerates.
4. Customized optical components are used, and Bessel or telephoto depth cutting heads are designed according to different products. Improve cutting quality and energy utilization.

Applications
1. Consumer display panel glass
2. Various types of protective cover glass
3. Glass slides in the medical industry
4. Photovoltaic industry glass
5. Architectural glass
6. Automotive glass
7. For other battery materials, please consult our relevant personnel

Specifications
1. Processing range: 300*400mm (customizable according to needs)
2. Marble motion platform positioning accuracy ≤±2μm, repeatability ≤±1μm
3. CCD positioning accuracy ≤±3μm
4. Processing speed: 1-300mm/s
5. Cutting size accuracy ≤±20μm
6. Cutting position accuracy ≤±30μm
7. Edge collapse size ≤20μm
8. Processable file formats: standard Gerber files, DXF files, DWG files, etc.
9. Windows 11 control PC, 21.5-inch display
10. TeamViewer remote access
11. Installation and training by Microtreat staff on site
12. Collect dust through dust collecting fan, exhaust flow: >200m3/h, air duct diameter: ￠100mm
13. Compressed air pressure: 0.5~0.7Mpa, flow: <200L/min, compressed air pipe diameter: ￠10mm
14. Marble base and metal welding frame
15. Ground feet with seismic isolation function
16. Overall dimensions: 1450mm×1650mm×2000mm, 2500kg (300x400mm processing platform)
17. Rated power 15KW
18. 3-color status signal tower
19. Interlock or Sensor installed at all door panel positions

Options
1. Local power
>208V/60Hz
>480V/60Hz
2. Optional automatic loading and unloading
3. Multiple laser configurations to adapt to materials of different thicknesses
Different power lasers: 15W, 30W, 45W, 60W, etc.
4. Contact us to learn about your specific needs