1. Edge chipping commitment: edge chipping size ≤50μm, cutting yield ≥99.9%.
2. Ultra-thin limit: support 0.1mm ultra-thin glass non-destructive cutting, breaking through the bottleneck of perovskite lightweight component process.
3. Second-level changeover: one-click cutting formula in the parameter library, and the conversion time is less than 1 minute.
4. Compatible with special-shaped sizes: dynamic multi-axis cutting, support for special shapes, and adapt to BIPV customized scenarios.
5. Future compatibility**: reserve automatic loading and unloading modules and edge cleaning systems.

Photovoltaic glass cutting machine
The perovskite photovoltaic glass cutting machine is specially designed for the large-size glass substrates or devices of perovskite components to split into different sizes. It adopts ultra-fast laser cold cutting technology to achieve small edge chipping and no micro-crack cutting (edge ??chipping size ≤50μm), cutting speed ≥500mm/s, and straightness accuracy ±5μm/m. Equipped with multi-axis linkage and filament focusing system, it supports one-time forming of special-shaped contours.

Highlights
1. The glass is modified by focusing a 3-5 micron spot with a focal depth of ≥6mm through an infrared picosecond high-energy laser beam;
2. The product has high size compatibility and can process graphics smaller than the platform size;
3. Equipped with a Bessel cutting head and a CO2 heating system;
4. The infrared laser has high stability and a lifespan of ≥20,000 hours;
5. Dynamic multi-link cutting, supports special shapes, and is suitable for customized BIPV scenarios
6. The operation interface is intuitive, and the cutting path can be edited according to the drawing

Features
1. Semi-automatic and automatic operation modes can be switched;
2. Customized semi-automatic mode for efficient testing;
3. Equipped with an edge cleaning system to remove the film layer and leave a cutting path;
4. The XY-axis high-precision linear motor can perform interpolation motion and etch special-shaped patterns;
5. Equipped with infrared picosecond and CO2 lasers, small pieces are cut using the principle of thermal expansion and contraction;
6. Small edge collapse, high yield, and no cracks.

Applications
1. Conductive glass cutting
2. CdTe battery segmentation
3. Perovskite single stack battery segmentation
4. BIPV battery segmentation
5. Suitable for R&D and small batches
6. For other battery materials, please consult our relevant personnel

Specifications
1. Product size: ≤1200x2400mm, customizable
2. Industrial camera equipped with high-magnification telecentric lens, CCD positioning accuracy ≤±3μm
3. Glass thickness: 0.1-6mm
4. X/Y linear motor positioning accuracy ≤±3μm, repeatability ≤±2μm
5. Maximum processing speed: 500mm/s
6. Cutting size accuracy ≤±5μm
7. Collapse ≤50μm
8. No cracks
9. File formats that can be processed: standard Gerber files, DXF files, DWG files, etc.
10. Windows 11 control PC, 21.5-inch monitor
11. TeamViewer remote access
12. Installation and training on-site by Microtreat staff
13. Collect edge cleaning dust through dust collection fan, exhaust flow: >200m3/h, air duct diameter: ￠100mm
14. Compressed air Pressure: 0.5～0.7Mpa, flow rate: <200L/min, compressed air pipe diameter: ￠10mm
15. Marble base and metal welded frame
16. Ground feet with seismic isolation function
17. Overall dimensions: 1300mmx1300mmx2000mm, 1800kg (300x300mm processing platform)
18. Rated power 12KW, average power 7KW
19. 3-color status signal tower
20. Equipped with safety light curtain, Interlock or Sensor installed at all door panel positions

Options
1. Local power
>208V/60Hz
>480V/60Hz
2. Equipped with different powers according to cutting rhythm
>1064m output power: 30W, 60W, 90W
>CO2 output power: 60W, 100W, 150W
3. Fully automatic loading and unloading modules and edge cleaning system can be added;
4. Contact us to learn about your specific needs