PLS Series
1. High-precision processing: micron-level scribing accuracy (line width ≤ 20μm) ensures efficient segmentation and series connection of battery cells and improves photoelectric conversion efficiency.
2. Non-destructive process: short-pulse laser technology accurately controls the heat-affected zone to avoid damage to the perovskite active layer and ensure battery performance.
Thin Film Solar Module Laser Scribing System
The perovskite laser P1-P3 scribing machine is a high-precision laser processing equipment designed specifically for perovskite solar cell production lines. Through the three precision laser scribing processes of P1, P2, and P3, efficient segmentation of battery cells and preparation of series structures are achieved. The use of a highly stable short-pulse laser source and an advanced optical system can accurately control the scribing depth (micrometer level) and line width (≤20μm) to ensure that the battery active layer is free of thermal damage and improve the photoelectric conversion efficiency. The equipment is equipped with intelligent visual positioning and automated control systems, supports compatible processing of flexible substrates and glass substrates, and has high-speed scribing (≥1m/s), modular design, and cloud-based management of process parameters, helping to improve the yield of perovskite battery mass production and reduce costs and increase efficiency.
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1. High-precision processing: micron-level scribing accuracy (line width ≤ 20μm) ensures efficient segmentation and series connection of battery cells and improves photoelectric conversion efficiency.
2. Non-destructive process: short-pulse laser technology accurately controls the heat-affected zone to avoid damage to the perovskite active layer and ensure battery performance.
3. High speed and high efficiency: scribing speed ≥ 1m/s, adapted to the rhythm of mass production, significantly improving production line efficiency and capacity.
4. Flexible compatibility: supports a variety of materials such as glass and flexible substrates to meet the needs of different process routes.
5. Intelligent control: integrated visual positioning and automation system, intelligent adjustment of process parameters, and high yield stability.
6. Modular design: supports function expansion and cloud data management, reduces maintenance costs, and helps to upgrade production lines to intelligence.
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1. Etch the film layer by focusing the laser beam on a um-level spot;
2. The size of the processed product is highly compatible and can be customized;
3. Graphics, numbers and continuous dotted lines can be drawn through a special control method;
4. The narrowest line width can be 10um, and Gaussian light and flat-top spots can be customized.
5. There are a variety of laser wavelengths and pulse widths (ns/ps/fs) to choose from.
6. The operation interface is intuitive and easy to create new recipes and engineering files.
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1. Semi-automatic and automatic operation modes, switchable.
2. Customized semi-automatic mode for efficient testing.
3. Advanced machine vision positioning system, equipped with high-precision CCD camera.
4. XY axis high-precision linear motor for interpolation motion.
5. Equipped with fiber and solid laser, different parameters can be set through software recipes.
6. Small etching heat affected area and low crater height.
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1. CIGS cell P1-P3 marking
2. Cadmium telluride cell marking
3. Perovskite single stack cell marking
4. BIPV cell with different light transmission markings
5. Suitable for R&D and small batches
6. For other cell materials, please consult our relevant personnel
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1. Product size: minimum 10x10mm, maximum 600x1200mm, custom sizes supported
2. Industrial camera equipped with high-power telecentric lens, CCD positioning accuracy ≤±3μm
3. Rigid glass thickness: 0.7-3.2mm; compatible with flexible
4. X/Y linear motor positioning accuracy ≤±3μm, repeatability ≤±2μm
5. Maximum processing speed: 1000mm/s
6. Marking accuracy ≤±10μm
7. Unilateral heat impact ≤10μm
8. Crater height: P1/P2≤20nm, P3≤200nm (determined by material)
9. File formats that can be processed: standard Gerber files, DXF files, DWG files, etc.
10. Windows 11 control PC, 21.5-inch monitor
11. TeamViewer remote access
12. Installation and training by Microtreat staff on site
13. Dust is collected by dust collector, exhaust flow: >200m3/h, air duct diameter: ¢100mm
14. Compressed air pressure: 0.5~0.7Mpa, flow: <200L/min, compressed air pipe diameter: ¢10mm
15. Marble base and metal welding frame
16. Ground feet with seismic isolation function
17. Overall dimensions: 1650mm×1750mm×2000mm, 2500kg (600x600mm processing platform)
18. Rated power 15KW, average power 8KW
19. 3-color status signal tower
20. Can be UL Certification
21. Equipped with safety sliding door, all door panels are equipped with Interlock or Sensor
Industry Pioneer?– Leading thin-film laser scribing technology since 2021.
Turnkey Support?– On-site installation, training, and UL-certified safety systems.
Future-Ready?– Scalable designs for next-gen perovskite and flexible PV manufacturing.
1. Local power >208V/60Hz
>480V/60Hz
2. Multiple laser wavelengths for optimal material absorption
>355nm 15W output power
>532nm 15W output power
>1064nm 20W output power
3. Lasers with different pulse widths: nanosecond fiber lasers, picosecond, femtosecond and other ultrafast lasers
4. Contact us to learn about your specific needs
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E-mail: mkxn@szmicrotreat.com
Tel.: +86 512 8391 9217
Tel.: +86 173 1528 3532
Tel.: +86 188 6210 4169
WhatsApp: +8618015504961
Add.: Building 7, No. 25, Datong Road, High-tech Zone, Suzhou City, China